BEDROCK R7000 BASIC - Unmatched Fanless Performance
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Power & Efficiency in Perfect BalanceSolidRun Bedrock R7000 Basic is powered by AMD RyzenTM 7 7840HS / 7840U processor with 8 Zen 4 cores and 16 threads running at up to 5.1 GHz. The APU has an integrated AMD RadeonTM 780M GPU with 12 CUs running at 2700 MHz. The chip is fabricated using TSMC state-of-the-art 4nm FinFET process, and is the most power efficient high-performance x86 CPU on the market for compute and graphics workloads. |
Packed Solid with FeaturesThe I/O, storage and networking devices found in SolidRun’s Bedrock R7000 Basic stand out in both performance and capacity. 4 display outputs HDMI 2.1 / DP 2.1 each 8K capable or 4x4K are driven by the powerful Radeon 780M GPU. 64 GB DDR5 with ECC, 3x NVME Gen4 2280, 2x 2.5 GbE ports, WiFi 6E, 5G modem with dual SIM and 4 USB ports. All these features are tightly packed in a fanless enclosure of under 1 liter. |
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Remarkable Fanless CoolingHot chips require innovative cooling. Bedrock was designed from the ground up for effective fanless cooling. The CPU is thermally coupled to the chassis using liquid metal TIM to reduce thermal resistance. Stacked heatpipes distribute the heat evenly 360º around the all-aluminum chassis. To optimize convective heat transfer, each chassis wall has two heat exchange layers – aluminum air-ducts that stimulate airflow by chimney effect, and another layer of conventional cooling ribs. As a result, Bedrock can dissipate over 3 times the power of fanless computers of similar size. |
Full Control of CPU PowerWith Bedrock R7000 you don’t have to guess how much power the system draws. Instead you can precisely set CPU power limit across an exceptionally broad power range of 8W to 54W. This is particularly useful in scenarios where limited power has to be shared between the IPC and additional devices, and when integration constraints prevent ideal heat dissipation.
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Rock Solid ReliabilityBedrock is designed with reliability in mind based on decades of experience in development of IPCs and embedded systems. DC power is through a terminal block with screw locking and has a wide voltage range of 12V – 60V with two stages of regulation. RAM supports ECC. NVMe with power-loss-protection (PLP) can be ordered. Bedrock has redundant SPI Flash to prevent bricking by BIOS corruption as well as WDT and TPM. The enclosure is extremely ruggedized – all-aluminum, fanless and ventless dust-resistant IP40.
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Innovative Modular DesignBedrock is designed to address the diversity of requirements in the IoT space. This is achieved by partitioning the hardware into the following boards:
This modular design enables agile customization of Bedrock for addressing specific requirements. SolidRun is developing multiple NIO, SX and PM boards that can be mixed and matched as an off-the-shelf solution and also offers development of custom boards as an ODM service. Customers and 3rd parties that are interested in developing custom NIO, SX or PM boards are welcome to contact SolidRun for support. Bedrock enclosure is designed with customization in mind. Modification of I/O, power input, antenna openings etc. can be performed cost effectively even in small volume. |
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Painless integrationThe compact footprint of Bedrock, robust structure, effective fanless cooling and DC input tolerance simplify Bedrock integration. All Bedrock I/O is brought to the front panel, with DC input and antennas in the top panel. The bottom and rear panel are both reserved for mounting, allowing full usability while Bedrock is mounted to a wall or to a desk. |
Field usabilityAs a fanless, ventless IPC Bedrock requires no maintenance. Bedrock is designed to avoid the need to open it in the field. SIM cards are accessible from the panel using pin-hole trays. Remote power button connector is conveniently located on the top panel. All brackets and mounting fixtures are assembled from the outside. Should the need arise to open Bedrock (e.g. to install a storage device or replace the RTC battery) Bedrock opens by unscrewing a single screw. |
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The 0.6 liter Bedrock TileWhen integrating an IPC in tight space convection cooling becomes ineffective and is better replaced with conduction cooling. It is also desirable to make the IPC as compact and thin as possible. |
Advanced integration using DeckSome integration scenarios call for custom enclosures (e.g. when additional devices must be installed with the computer in the same housing). To support these use cases Bedrock introduces the Deck concept (deck-of-cards). The SoM, NIO, SX and PM are rigidly held together with fasteners independently of the Bedrock enclosure. The Deck provides first stage cooling for most devices, in particular it includes a copper heat-plate on the CPU. The Deck is fastened to the custom chassis with only 3 screws. Fastening provides thermal coupling to the CPU, RAM, NVMe and FETs. The DC input connector is on wires and can be relocated in the chassis. |
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Designing with Bedrock SoMBedrock SoM makes a convenient and flexible building block for board designers. For many developers, using a SoM would be the only way to develop a computer based on AMD Ryzen™ Embedded V3000. Bedrock SoM makes an attractive platform for that purpose for several reasons. The SoM is far more self-contained than traditional SoMs. It has not only the essential CPU and RAM, but also NVMe, direct DC input with 12V – 19V tolerance and RTC battery. The SoM is provided in a ruggedized metal skirt that protects the SoM, provides mounting fixture for extension cards and serves as a heat-spreader for secondary heat sources. Copper heat-plate is pre-assembled on the CPU. |
Specifications
Feature |
Specification |
Notes |
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CPU | AMD Ryzen™ 7040 Series 8C/16T Zen4 4nm Up to 5.1 GHz Up to 54W |
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GPU | AMD Radeon™ 780M | Up to 12 CU @ 2700 MHz |
RAM | Dual channel DDR5 up to 64 GB ECC / non-ECC | 2x SODIMM (2×32 bit each) RAM is conduction cooled |
Display | 1x HDMI 2.1 1x Display Port 2.1 2x mini-DisplayPort 2.1 |
Max resolution / refresh rate: 7680×4320 @ 60Hz 3840×2160 @ 240H |
Main storage | NVMe PCIe Gen4 x 4 | M.2 key-M 2280 Optional power-loss-protection NVMe is conduction cooled |
Extra storage | 2x NVMe PCIe Gen4 x 4 | 2x M.2 key-M 2280 NVMe devices are conduction cooled |
LAN | 2x 2.5 GbE (Intel I226) | 2x RJ45 |
WLAN | WiFi 6E (Intel AX210) BT 5.3 |
2x RP-SMA antennas Optional and upgradable (M.2 key-E 2230) |
Modem | 4G / 5G (Quectel) | 2x SMA antennas Optional and upgradable (M.2 key-B 3042 / 3052) |
USB | 1x USB 3.2 gen 2 10 Gb/s 3x USB 3.2 gen 2 5 Gb/s |
Connectors: 4x USB type-A |
Console | Serial over USB | mini-USB connector |
BIOS | AMI Aptio V | Dual SPI FLASH for redundancy Console redirection |
Operating systems | Windows 10/11/IoT, Linux | Other x86 operating systems supported |
Power | DC 12V-60V | Phoenix terminal Other DC connectors available |
Temperature range | Up to -40ºC to 85ºC | Also available in commercial temperature range |
Enclosure | All aluminum enclosure, fanless cooling | Bedrock V3000 Basic 60W Version |
Dimensions | 30W model: 45 mm (W) x 160 mm (H) x 130 mm (D) – 0.9 liter
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Mounting | DIN-rail, wall, table top |